ZI
ZACHARY ISAKOWITZ
SEMICONDUCTOR INDUSTRY ASSOCIATION · Washington, DC · registered since 2024
Registered · LDAActive
At a glance
Registered since
2024
Senate LDA system
Clients
1
last 3 years
Filings
3
22 agencies contacted
Activity
filings by quarter
Works on
Background
Government experience
U.S. Congressman Michael McCaul
Legislative Director and Coalitions Director; U.S. Department of the Treasury, Director of Public Affairs, Special Assistant to the Under Secretary for TFI, and Special Assistant to the Secretary for Advance
Disclosed on LD-2 filings
Career
SI
Specific issues
American Innovation and Jobs Act (S. 866); American Innovation and R&D Competitiveness Act H.R. 2673. Policy issues related to Treasury proposed regulations on 48D of the CHIPS and Science Act (P.L. 117-167); tax policy issues related to incentivizing research and development and semiconductor design activities. Taiwan Tax Agreement Act (H.R. 4729, S. 1457), U.S.-Taiwan Expedited Double Tax Relief Act.United States-Taiwan Expedited Double-Tax Relief Act (S. 3084 and H.R. 5988).Tax Relief for American Families and Workers Act of 2024 (H.R. 7024). Issues related to OECDs Pillar Two implementation.Semiconductor Technology Advancement and Research (STAR) Act (H.R. 9183).
Americas Supply Chains Executive Order 14017, ICTS Supply Chain Executive Order 13873. Implementation of the CHIPS and Science Act of 2022 (P.L. 117-167).Spectrum and National Security Act of 2024 (S. 4207).
Export Control Reform Act (P.L. 115-232) implementation, potential controls on emerging and foundational technologies, matters related to Commerce Department Entity list and export licenses, including provisions in the House and Senate FY25 Commerce, Justice, Science, and Related Agencies Appropriations Bill reports.
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, sect. DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency in relation to Taiwan. Semiconductor policy issues related to the FY 25 National Defense Authorization Act (H.R. 8070) (export control, outbound investment, NEPA, and other semiconductor related matters). The Building Chips in America Act of 2023 (S. 2228, H.R. 4549). Implementation of the CHIPS and Science Act of 2022 (PL 117-167). The Chip Equipment, Quality, Usefulness, and Integrity Protection (Chip EQUIP) Act (S. 4585, H.R. 8826). Outbound Investment Transparency Act of 2023 (S.2678). Chinese Military and Surveillance Company Sanctions Act of 2023 (H.R.760). Maintaining American Superiority by Improving Export Control Transparency Act (H.R. 6614). Various measures under consideration by the House Foreign Affairs Committee (H.R. 6602, H.R. 6606, H.R. 5613, H.R. 7151, H.R. 8152, H.R. 8315, H.R. 8924), and the Preventing Regional Catastrophes in 2027 Act); policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors to Russia. Chip EQUIP Act (S. 4585). Legislation related to semiconductor hardware security.Issues related to guardrails on CHIPS Act funding.
Federal expenditures on semiconductor R&D, semiconductor manufacturing incentives, basic research and education (Appropriations for Dept of Commerce, NSF, NIST, DARPA, Dept of Defense, Dept of Energy), as authorized by CHIPS & Science Act (P.L. 117-167).
PFAS legislative and regulatory policy. Permitting reform, including NEPA process and returns in Fiscal Responsibility Act and FY24 NDAA. The Building Chips in America Act of 2023 (S. 2228, H.R. 4549).