SEMICONDUCTOR INDUSTRY ASSOCIATION

American Innovation and Jobs Act (S. 866); American Innovation and R&D Competitiveness Act H.R. 2673. Policy issues related to Treasury proposed regulations on 48D of the CHIPS and Science Act (P.L. 117-167); tax policy issues related to incentivizing research and development and semiconductor design activities. Taiwan Tax Agreement Act (H.R. 4729, S. 1457), U.S.-Taiwan Expedited Double Tax Relief Act.United States-Taiwan Expedited Double-Tax Relief Act (S. 3084 and H.R. 5988).Tax Relief for American Families and Workers Act of 2024 (H.R. 7024).

American Innovation and Manufacturing (AIM) Act (enacted as part of the Consolidated Appropriations Act of 2020 (P.L. 116-260)), PFAS legislative and regulatory policy. Sale of Federal Helium System and resiliency of the helium supply chain. Permitting reform, including NEPA process and returns in Fiscal Responsibility Act and FY24 NDAA. The Building Chips in America Act of 2023 (S. 2228, H.R. 4549).

Americas Supply Chains Executive Order 14017, ICTS Supply Chain Executive Order 13873. Implementation of the CHIPS and Science Act of 2022 (P.L. 117-167).

Export Control Reform Act (P.L. 115-232) implementation, potential controls on emerging and foundational technologies, matters related to Commerce Department Entity list and export licenses, White House supply chain report under (EO 14017) expansion of the World Trade Organization (WTO) Information Technology Agreement (ITA); Semiconductor supply chain rebalancing. Issues regarding USTR Withdrawal of US Digital Trade Priorities at WTO. Policy matters related to MC13 to encourage Vietnam to join the WTO Information Technology Agreement Expansion (ITA2) and secure renewal of the WTO e-commerce moratorium.

Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, sect. DOD appropriations, DARPA ERI Program. Issues related to U.S trade, national security and semiconductor supply chain resiliency in relation to Taiwan. Semiconductor policy issues related to the FY 24 National Defense Authorization Act (S. 2226, H.R. 2670) (export control, outbound investment, NEPA, other). The Building Chips in America Act of 2023 (S. 2228, H.R. 4549). Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Outbound Investment Transparency Act of 2023 (S.2678). Chinese Military and Surveillance Company Sanctions Act of 2023 (H.R.760).Maintaining American Superiority by Improving Export Control Transparency Act (H.R. 6614); increasing transparency in customs anticounterfeiting and intellectual property protection efforts (S.Amdt.484 to S. 2226, National Defense Authorization Act for Fiscal Year 2024).Export Control Enforcement and Enhancement Act (H.R. 7151); legislation to amend the Export Control Reform Act of 2018 relating to the review of the interagency dispute resolution process (H.R. 6602);policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors to Russia.